Industry challenges
What engineers in this field are up against — and our response
01
Challenge
光输出模块的热稳定性
Our response
可伐/铜壳体复合结构,膨胀匹配加镀金,让发射器对准在温度循环中保持稳定。
02
Challenge
无污染、可焊表面
Our response
受控电镀(Cu–Ni–Au)与清洗,让可焊性与离子污染满足组装规范。
03
Challenge
多品种小批量工程
Our response
无起订量车削与柔性铣削,吸收频繁设计变更而零工装成本。
What we manufacture
Components for 光通信
激光器封装壳体、光通信封装壳体、TO 底座、光学支架、泵浦腔体与 AuSn-ready 散热载体。
Recommended products
Representative parts
Recommended capabilities
Processes this industry relies on
Quality requirements
What this industry expects
Dimensional reports, plating thickness records and cosmetic standards agreed per order.
Request a Quote
Working on a 光通信 project?
Tell us the application, material and tolerance — we review the drawing before quoting.