激光与光电子 Demo
激光器封装壳体
Kovar / SUS304 激光器封装壳体，Cu–Ni–Au 镀层，气密性与光学窗口面精度可控，适配激光器芯片封装与热管理需求。
- Materials
- Kovar · SUS304 · OFC
- Tolerance
- ±0.005 mm hole accuracy (part-dependent)
- Surface finish
- Cu → Ni → soft gold (Type III, ≥99.9%)
- Dimensions
- Per customer drawing
- Batch size
- Prototype to volume
设计要点
关键特性
技术规格
材料与规格
| Parameter | Value | Unit / Note |
|---|---|---|
| Body material | Kovar / SUS304 | per drawing |
| Base plate | OFC / tungsten-copper | thermal option |
| Plating stack | Cu–Ni–Au | soft gold Type III |
| Lead pins | 4J29 / 4J50 copper-cored | |
| Platform class | 10–1000 W | housing platform range (brochure) |
| Hole accuracy | ±0.005 mm | part-dependent |
Values shown are per this product entry; customer drawings take precedence.
制造过程
它如何被制造
CNC milling and turning → deburr and clean → copper / nickel / gold plating → final dimensional and plating-thickness inspection.
应用场景
它被用在哪里
Laser package housings carry the pump diode, optics and thermistor of a laser module. This demo entry illustrates the product template: a Kovar or SUS304 body with an oxygen-free-copper or tungsten-copper base, machined seats for the submount and a Cu–Ni–Au plating stack for solderability. Replace with a verified product entry.
FAQ
Frequently asked questions
Which plating purity grades are available?
Soft gold Type III ≥99.9%, hard gold Type I ≥99.7%, hard gold Type II ≥99.0%.
Can the base be tungsten-copper?
Yes — base plates are offered in OFC or tungsten-copper per thermal requirements.
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