Product family
热管理组件
Liquid cold plates, heat sinks and cooling manifolds that keep high heat-flux electronics inside their thermal budget.
Overview
What this family covers
Thermal management parts for AI compute, laser sources and power electronics. Copper and aluminum cold plates are machined, joined and leak-tested so contact-face flatness and channel integrity hold under sustained load. Vacuum brazing is listed per the product roadmap and is pending capability confirmation.
Applications
- AI liquid cooling & robotics
- Semiconductor & laser equipment
- Medical aesthetics
Products
2 representative parts
Demo entries illustrate the product template; verified products replace them family by family.
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