Product family

Thermal Management Components

Liquid cold plates, heat sinks and cooling manifolds that keep high heat-flux electronics inside their thermal budget.

Thermal Management Components

Overview

What this family covers

Thermal management parts for AI compute, laser sources and power electronics. Copper and aluminum cold plates are machined, joined and leak-tested so contact-face flatness and channel integrity hold under sustained load. Vacuum brazing is listed per the product roadmap and is pending capability confirmation.

Applications

  • AI liquid cooling & robotics
  • Semiconductor & laser equipment
  • Medical aesthetics

Products

2 representative parts

Demo entries illustrate the product template; verified products replace them family by family.

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Thermal Management Components Demo

Aluminum Liquid Cold Plate

Machined-channel aluminum cold plate with welded closure and 100% leak check — flat contact faces for direct die mounting. Demo placeholder product.

  • Aluminum 6061 / 6063
  • Flatness ±0.005 mm (contact face, part-dependent)
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Thermal Management Components Demo

Copper Heat Sink Blank

Copper heat sink blanks and skived-fin bodies for laser and power electronics. Demo placeholder product.

  • Copper / OFC
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