Laser Package Housing

Kovar / SUS304 laser package housing with a Cu–Ni–Au plating stack, engineered for stable thermal and optical alignment. Demo placeholder product.

Materials: Kovar · SUS304 · OFC
Tolerance: ±0.005 mm hole accuracy (part-dependent)
Surface finish: Cu → Ni → soft gold (Type III, ≥99.9%)
Dimensions: Per customer drawing
Batch size: Prototype to volume

Request a Quote for this part

Laser Package Housing — brochure photo 2

Design considerations

Key features

01Thermal stabilityKovar body with oxygen-free-copper base keeps the emitter interface dimensionally stable through power cycles.

02Publication-grade platingCopper → nickel → soft gold stack with purity grades ≥99.9% (Type III soft gold).

03Single-setup accuracyBores, seats and port faces machined against shared datums — ±0.005 mm hole accuracy benchmark.

Technical specifications

Materials & specifications

Parameter	Value	Unit / Note
Body material	Kovar / SUS304	per drawing
Base plate	OFC / tungsten-copper	thermal option
Plating stack	Cu–Ni–Au	soft gold Type III
Lead pins	4J29 / 4J50 copper-cored
Platform class	10–1000 W	housing platform range (brochure)
Hole accuracy	±0.005 mm	part-dependent

Values shown are per this product entry; customer drawings take precedence.

Manufacturing

How it is made

CNC milling and turning → deburr and clean → copper / nickel / gold plating → final dimensional and plating-thickness inspection.

CNC MillingMulti-face milling for housings, cold plates and structural parts to ±0.005 mm benchmark accuracy.ElectroplatingGold, nickel, silver, palladium and alloy plating with published purity grades and selective plating.

Applications

Where it is used

Laser package housings carry the pump diode, optics and thermistor of a laser module. This demo entry illustrates the product template: a Kovar or SUS304 body with an oxygen-free-copper or tungsten-copper base, machined seats for the submount and a Cu–Ni–Au plating stack for solderability. Replace with a verified product entry.