Electroplating · Capability Draft copy

Electroplating

Gold, nickel, silver, palladium and alloy plating with published purity grades and selective plating.

≥ 99.9% Soft gold purity

Type III

Electroplating

Process overview

What this capability delivers

Plating service covers all types of precision parts. Purity grades are published per the brochure: soft gold (Type III) ≥ 99.9%, hard gold (Type I) ≥ 99.7%, hard gold (Type II) ≥ 99.0%. The standard composite stack is copper → nickel → gold for adhesion and surface stability. Selective (partial) electroplating defines exact plating zones, keeps functional properties intact and reduces precious-metal consumption.

Copy adapted from the brochure — pending review.

Tolerance / technical data

Capability benchmarks with applicability

MetricCapabilityApplicability
Soft gold purity≥ 99.9%Type III
Hard gold purity≥ 99.7% / ≥ 99.0%Type I / Type II

Figures are capability benchmarks. Achievable tolerance depends on geometry, material and feature size — confirmed per drawing in DFM review.

Industries

Where this capability is applied

FAQ

Frequently asked questions

Which plating stacks do you run?

Copper–nickel–gold stacks for package and optical components, plus nickel and selective gold. The nickel layer acts as a diffusion barrier; gold provides solderability and corrosion resistance.

Can you plate selectively — only part of the surface?

Yes, selective plating masks non-plated zones; thickness and coverage are specified per drawing. See the case study on a Kovar laser package with selective gold plating.

How is plating thickness verified?

Thickness is controlled by process and verified per the inspection plan agreed in the RFQ — XRF where applicable, and witness samples for destructive checks.

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Have a drawing or technical requirement?

Upload your drawing and tell us your material, tolerance, quantity and application. Our engineering team replies within 1–2 business days.